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Journal of the Korean Institute of Electromagnetic and Science 2002;2(2):59-64.
Micromachined Low-Loss Low-Dispersion Elevated CPW for High-Speed Interconnects
S. H. Jeong1, S. N. Lee2, S. G. Lee3, J. G. Yook2, Y. J. Kim4, H. K. Park2
1Samsung Electronics Co. Ltd.
2Department of Electrical and Electronics Eng., Yonsei University
3Samsung Advanced Institute of Technology
4Department of Mechatronics eng., Yonsei University
Abstract
In this paper, 10$mu$ m-elevated MEMS CPWs on various substrates are presented. Effective dielectric constants of elevated CPW(ECPW) on polyimide-loaded silicon or alumina substrate are examined and characteristic impedances are also computed versus elevation height. Dispersive property of ECPW and its electromagnetic field distributions are studied through 3-D FDTD algorithm for optimum design. Attenuation of ECPW is measured with TRL calibration procedure and revealed about 3.2 43 lower than that of conventional CPW on the same low-resistivity silicon at 40 CHz. ECPW on polyimide-loaded silicon with overlapped configuration reveals 0.2 dB/mm. Especially, alumina substrate imposes better attenuation than silicon.
Key words: Elevated CPW, Low Loss, Low Dispersive, High-Speed Transmission Line
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