| Electrical Parameter Extraction of High Performance Package Using PEEC Method |
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Bo Pu, Jung-Sang Lee, Wan-Soo Nah |
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Department of Electrical and Electronics Engineering, Sungkyunkwan University |
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| Abstract |
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This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA). |
| Key words:
Electrical Characterization, Equivalent Model, Interconnect, Package, Partial Element Equivalent Circuit |
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