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- GHz EMI Characteristics of 3D Stacked Chip PDN with Through Silicon Via (TSV) Connections
- Jun-So Pak, Jong-Hyun Cho, Joo-Hee Kim, Ki-Young Kim, Hee-Gon Kim, Jun-Ho Lee, Hyung-Dong Lee, Kun-Woo Park, Joung-Ho Kim
- J. Electromagn. Eng. Sci. 2011;11(4):282-289.
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- Equivalent Circuit Parameters of S-band 1.5 Cell RF Gun Cavity
- Ki-Young Kim, Heung-Sik Kang, Heung-Sik Tae
- J. Electromagn. Eng. Sci. 2004;4(1):30-36.
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