Modeling and Prediction of Electromagnetic Immunity for Integrated Circuits

Pu, Bo; Kim, Taeho; Kim, SungJun; Kim, SoYoung; Nah, Wansoo

doi:2013.13.1.54

J. Electromagn. Eng. Sci > Volume 13(1); 2013 > Article

Journal of Electromagnetic Engineering and Science 2013;13(1):54-62.
DOI: https://doi.org/10.5515/JKIEES.2013.13.1.54

Modeling and Prediction of Electromagnetic Immunity for Integrated Circuits

Bo Pu¹, Taeho Kim¹, SungJun Kim¹, SoYoung Kim², Wansoo Nah¹

¹Dept. of Electrical and Electronics Engineering, Sungkyunkwan University
²Dept. of Semiconductor System Engineering, Sungkyunkwan University

Abstract

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

Key words: Electromagnetic Immunity, Integrated Circuits, Modeling, Direct Power Injection