1. L. Nayak, S. Mohanty, S. K. Nayak, and A. Ramadoss, "A review on inkjet printing of nanoparticle inks for flexible electronics,"
Journal of Materials Chemistry C, vol. 7, no. 29, pp. 8771–8795, 2019.
https://doi.org/10.1039/C9TC01630A
2. B. Ando, "Inkjet printing: a real opportunity for the next generation of low-cost sensors,"
IEEE Instrumentation & Measurement Magazine, vol. 16, no. 3, pp. 44–48, 2013.
https://doi.org/10.1109/MIM.2013.6521134
3. D. H. Song, M. H. Choi, J. Y. Kim, J. Jang, and S. Kirchmeyer, "Process optimization of organic thin film transistor by ink-jet printing of DH4T on plastic,"
Applied Physics Letters, vol. 90, no. 5, article no. 053504, 2007.
https://doi.org/10.1063/1.2437684
4. M. Singh, H. M. Haverinen, P. Dhagat, and G. E. Jabbour, "Inkjet printing: process and its application,"
Advanced Materials, vol. 22, no. 6, pp. 673–685, 2010.
https://doi.org/10.1002/adma.200901141
5. J. A. Jeong, J. Kim, and H. K. Kim, "Ag grid/ITO hybrid transparent electrodes prepared by inkjet printing,"
Solar Energy Materials and Solar Cells, vol. 95, no. 7, pp. 1974–1978, 2011.
https://doi.org/10.1016/j.solmat.2011.02.016
6. B. Kim, M. L. Geier, M. C. Hersam, and A. Dodabalapur, "Inkjet printed circuits on flexible and rigid substrates based on ambipolar carbon nanotubes with high operational stability,"
ACS Applied Materials & Interfaces, vol. 7, no. 50, pp. 27654–27660, 2015.
https://doi.org/10.1021/acsami.5b07727
7. H. Meier, U. Loffelmann, D. Mager, P. J. Smith, and J. G. Korvink, "Inkjet printed, conductive, 25 μm wide silver tracks on unstructured polyimide,"
Physica Status Solidi: Applied and Materials Science, vol. 206, no. 7, pp. 1626–1630, 2009.
https://doi.org/10.1002/pssa.200925088
8. J. H. Yu, Y. I. Cho, J. W. Lee, K. H. Choi, and S. H. Lee, "Area-selective atomic layer deposition of Al
2O
3 using inkjet-printed inhibition patterns and lift-off process,"
Journal of Information Display, vol. 24, no. 3, pp. 215–225, 2023.
https://doi.org/10.1080/15980316.2023.2189079
9. S. H. Lee, K. Y. Shin, J. Y. Hwang, K. T. Kang, and H. S. Kang, "Silver inkjet printing with control of surface energy and substrate temperature,"
Journal of Micromechanics and Microengineering, vol. 18, no. 7, article no. 075014, 2008.
https://doi.org/10.1088/0960-1317/18/7/075014
10. H. Kim, G. Y. Yun, S. H. Lee, and J. M. Kim, "High-resolution CPW fabricated by silver inkjet printing on selectively treated substrate,"
Sensors and Actuators A: Physical, vol. 224, pp. 1–5, 2015.
https://doi.org/10.1016/j.sna.2015.01.002
11. S. M. Sim, S. H. Lee, K. H. Cho, and J. H. Yu, "Feature size control by layer-by-layer printing and non-wettable patterns for inkjet printing of micro metal electrod,"
Journal of Electrical Engineering & Technology, vol. 16, no. 4, pp. 2157–2165, 2021.
https://doi.org/10.1007/s42835-021-00740-6
12. S. M. Sim, J. H. Yu, J. M. Kim, and S. H. Lee, "Ag ink-jet printed CPW with micro-surface cavities: effects of cavity removal on RF characteristics," In:
Proceedings of 2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC); Castelldefels, Spain. 2023, pp 109–111.
https://doi.org/10.1109/IMOC57131.2023.10379718
13. H. C. Jung, S. H. Cho, J. W. Joung, and Y. S. Oh, "Studies on inkjet-printed conducting lines for electronic devices,"
Journal of Electronic Materials, vol. 36, no. 9, pp. 1211–1218, 2007.
https://doi.org/10.1007/s11664-007-0194-5
14. D. Stephens, P. R. Young, and I. D. Robertson, "Millimeter-wave substrate integrated waveguides and filters in photoimageable thick-film technology,"
IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 12, pp. 3832–3838, 2005.
https://doi.org/10.1109/TMTT.2005.859862
15. R. D. Deegan, O. Bakajin, T. F. Dupont, G. Huber, S. R. Nagel, and T. A. Witten, "Capillary flow as the cause of ring stains from dried liquid drops,"
Nature, vol. 389, no. 6653, pp. 827–829, 1997.
https://doi.org/10.1038/39827
16. X. Xu and J. Luo, "Marangoni flow in an evaporating water droplet,"
Applied Physics Letters, vol. 91, no. 12, article no. 124102, 2007.
https://doi.org/10.1063/1.2789402
17. A. F. Horn, J. W. Reynolds, and J. C. Rautio, "Conductor profile effects on the propagation constant of microstrip transmission lines," In:
Proceedings of 2010 IEEE MTT-S International Microwave Symposium; Anaheim, CA, USA. 2010, pp 868–871.
https://doi.org/10.1109/MWSYM.2010.5515933
18. Z. Chen and W. Tian, "Effect of surface roughness on the electrical performances of CPW transmission lines used in future ultra-high frequency applications,"
Micromachines, vol. 14, no. 1, article no. 104, 2022.
https://doi.org/10.3390/mi14010104
19. Y. Morimoto, T. Motegi, W. Kasai, and K. Niwano, "Transmission line loss properties of dielectric loss tangent and conductive surface roughness in 5G millimeter wave band," In:
Proceedings of 2020 IEEE Asia-Pacific Microwave Conference (APMC); Hong Kong. 2020, pp 776–778.
https://doi.org/10.1109/APMC47863.2020.9331571
20. J. R. Deneault, C. Bartsch, A. Cook, C. Grabowski, J. D. Berrigan, N. Glavin, and P. R. Buskohl, "Conductivity and radio frequency performance data for silver nanoparticle inks deposited via aerosol jet deposition and processed under varying conditions,"
Data in Brief, vol. 33, article no. 106331, 2020.
https://doi.org/10.1016/j.dib.2020.106331
21. Y. Zhou, J. H. Chow, M. M. Tentzeris, and S. K. Sitaraman, "Experimental and modeling study of RF performance of a screen-printed coplanar waveguide (CPW) up to 20 GHz under monotonic stretching,"
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 7, pp. 1227–1239, 2024.
https://doi.org/10.1109/TCPMT.2024.3409526
22. N. A. Amoli, S. Sivapurapu, R. Chen, Y. Zhou, M. L. Bellaredj, P. A. Kohl, S. K. Sitaraman, and M. Swaminathan, "Screen-printed flexible coplanar waveguide transmission lines: multi-physics modeling and measurement," In:
Proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC); Las Vegas, NV, USA. 2019, pp 249–257.
https://doi.org/10.1109/ECTC.2019.00044
23. T. Shimizu and Y. Kogami, "Microwave characteristics of a conductor backed CPW by a home printed electronics technology with silver nanoparticle ink," In:
Proceedings of 2018 Asia-Pacific Microwave Conference (APMC); Kyoto, Japan. 2018, pp 1229–1231.
https://doi.org/10.23919/APMC.2018.8617124